Shopping cart

Subtotal $0.00

View cartCheckout

Subscribe to out newsletter today to receive latest news administrate cost effective for tactical data.

Let’s Stay In Touch

Neutral Silicone Sealant

APPLICATIONS :

• Weather sealing and joint sealing for walls, windows and doors.
• Glass to glass and glass to aluminium sealing.
• Sealing applications in kitchens and bathrooms.
• Sealing of connection joints in building industry (brick, wall, concrete, PVC, wood, glass etc.)

Description:

ESSRBOND 228 NP is neutral cure, premium performance silicone sealant designed for gap filling and sealing in a wide range of use in building and construction. It combines the advantages of outstanding adhesion to building materials and non-corrosive and odorless

Features

100% solvent less silicone,
Excellent weatherproof and UV resistant,
No cracking or shrinking,
Water resistant,
Very low Odor and non-corrosive
Excellent flexibility and adhesion to numerous porous and non-porous
Substrates for large scale construction and glazing applications.
Resistant to temperature extremes (-50 °C to +160 °C).
Fast curing, low modulus, high elasticity.
High viscosity non slump formula.

Properties Result Test Method
Base Silicone Polymer
Curing System Neutral
Density (Transparent) 1.00 ± 0.03 g/ml ASTM D 792
Density (Other Color) 1.35 ± 0.05 g/ml ASTM D 792
Shore A Hardness (Transparent) 20 – 30 (after 28 days)
Shore A Hardness (Other Color) 30 – 45 (after 28 days)
Tensile Strength ≥ 0.4 N/mm² (23°C and 50% RH) ISO 8339
Temperature Resistance -50°C to +160°C
Application Temperature +5°C to +40°C
Elongation at Break (Transparent) ≥ 400% ASTM D 412
Elongation at Break (Other Color) ≥ 350%
Elastic Recovery Approx. 100% ISO 7389
Sagging 0 mm ISO 7390

Packing: 310 ml cartridge 25 pcs in a box/600 Ml sausages 20 Pcs in a box.
Also can supply drums as per customers’ requirements.

Download Technical Data Sheet


PDF Icon
Download PDF

Reviews

There are no reviews yet.

Be the first to review “Neutral Silicone Sealant”

Your email address will not be published. Required fields are marked *