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If the product is processed cold, the minimum ambient and substrate temperature is +10 C. It is advisable to fog the adhesive film or the substrate to be bonded in case the materials are non-absorbent, or wood moisture is below 8 %. Please take care during pressing to prevent the press from glueing shut. Cover the press with a silicone release paper. Bonding result depend on the material properties and processing condition. We recommend preliminary customer trials. Clean the substrates to be bonded so that they are free from dust / rust / oil.
Availability: In Stock
Description:
ESSRBOND EB 100 is a moisture curing polyurethane based adhesive for binding of solid wood (especially of hard wood & tropical wood species), and also for many other substrate combinations like HPL/ Cpl, bonding to galvanized iron or metals, bonding expanded polystyrene (sanded) to wood, stone etc.
FEATURES
Good Adhesion to many substrates, moisture curing. Heat resistance up to 120 C.
TECHNICAL PROPERTIES:
| PROPERTIES | RESULTS |
|---|---|
| Viscosity [mPas] | Dark brown |
| Density [g / cm³] | Approx 100 |
| Solid Content at 20°C [%] | Approx 0.15 |
| VOC Content | None |
| Appearance of the glue film | Approx. 7.000 |
| Solvents | Approx 1.1 |
| Open Time at 25°C | Approx 30 min |
| Pressing Time at 25°C | Approx 90 min |
| Processing Temperature | >10°C |
| Foaming | Sight Foaming |
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